This chapter describes the K&S 4500 Series Manual Wire Bonders controls and indicators. 1.1 The Multi Mouse The Multi Mouse is located on the base either to the right or the left of the workholder table. The Multi Mouse has two functions: Control of the bonding cycle. Fine positioning of the bonding pad under the wedge/capillary.

HB06/12 is a manual/ semiautomatic thermo sonic wire or ribbon wedge bonder. This bonder was designed to make 0.5 to 3.0 mil gold or aluminum wire or up to 1.0 x 10. 0 mil gold or aluminum ribbon electrical interconnections on a wide range of microelectronic packages. HB08/14 is a manual/ semiautomatic thermosonic wire ball bonder. This bonder

Model 7400D Series, Wedge-Wedge Wire Bonders, Manual X-Y-Z Overview Year 2000 saw the "C" Series finally replace the venerable "A" Series, and now witnesses the transition accepts the new tool assemblies of the wire bonders as well as other cast-body tool assemblies. The angled wedge wire bond configuration is shown below.

Mech-El provides a full line of manual wire bonders for ultrasonic, thermosonic, and thermocompression bonding. Mech-El will continue to produce the 700, 800, 900 and 1200 series of bonders. Mech-el bonders will come with the MEI Manufacturers warranty. Mech-El is the only factory authorized service center. We provide prompt service and support.

Wire bonders for ball and wedge bonding on the same machine. Gold, aluminum, copper, platinum wires and ribbons up to diameters of 75um or sections of 

An advanced manual wire bonder for gold ball bonding or bumping (copper optional). More Convertible wire bonder between wedge or ribbon bonding and ball bonding with deep access wire feed. Legacy K&S Manual Wire Bonders Fully refurbished 2nd user Kulicke and Soffa (K&S) manual ultrasonic gold ball and wedge wire bonding equipment. More

Manual “E”Series models are available for all microwave, semiconductor, R.F., and hybrid production, and are ideal for repair station or laboratory use. MODEL 7374E adapted for

We made a manual wire bonder to prep samples that can be mounted in any orientation normal to the sample top down(0 degrees) or cross-sectional imaging (90 

Search for used manual wire bonder. Find Kulicke & Soffa, West Bond, Hughes, Palomar, and Orthodyne for sale on Machinio.

Manual Wire Bonders / Optional Die Bonder. Series 53 - Small, Manual, Easy; If you need 1 to 100 bonds per day; Complete, manual table top bonder 

Hesse Assist Tools: load cell, bondtool and wire spool detection, tool calibration without wedge gauge for operator independency. Outstanding features of the new Bondjet BJ985 are the large bonding area of 370 mm x 870 mm, a high drive through and high speed. Hesse , as technology leader, has designed the only heavy wire bondhead with a non

F&S Bondtec offers the perfect development machine with its manual wire bonder. Simple operation, extremely adaptable bonding settings, at an unbeatable price-performance ratio. - Complete, manual table top bonder - Unbeatable price-to-performance ratio - Extremely adaptable bond settings, loop shapes, force and power profiles etc.

The MPP iBond5000 Wire Bonder series is based on the proven 4500 Series, the market leader for nearly a decade, and used mainly for Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers, Chip-on-Boards, Leads, Sensors, High Power Devices and much more.

5. Semi-Auto Bonding 6. Manual Z Bonding 7. Spotlight Adjustment 8. Standard Wedge Tool and Wire Specifications for Au Wire Configuration . CRITICAL PRECAUTIONS AND COMMON MISTAKES • Keep hands out of the working a rea while the Bonding Tool is in operation • Be aware of high temperature of the work holder and use tweezers when placing the

We install extra-long bond arms/transducer in all our bonders. Further is the clamp and its screw installed on top of the tool instead of behind it. This unique combination is the key to access

The iBond5000-Wedge is an advanced wedge bonder- manual wire bonder- used for process development, production, research, or added manufacturing support.

Wire Bonding Manual for the. Kulicke & Soffa Ltd. Dicing Systems Wire Bonder. Model 4526. Written by Dane Gentry and Mario Verduzco. This manual is intended 

Industry Leader in semiconductor wire bonder, die bonder, wedge bonder, pull test and bonder tools. Leader in manufacturing renowned line of wire bonding and die attach machines, wire pull and shear test equipment, ultrasonic components, and accessories for the microelectronics packaging industry.

Manual Wire Bonders - NDC International. NDC International represents the MPP (Micro Point Pro LTD) line of manual wire bonders in the USA, Mexico and Canada. The long time leader in wire

The HB05 is a bench top size wire bonder, ideal for laboratories and pilot production lines. One bond head for bonding in ball/wedge or wedge/wedge bonding 

Model 7400D Series, Wedge-Wedge Wire Bonders, Manual X-Y-Z Overview Year 2000 saw the "C" Series finally replace the venerable "A" Series, and now witnesses the transition accepts the new tool assemblies of the wire bonders as well as other cast-body tool assemblies. The angled wedge wire bond configuration is shown below.