① Long capillary life means less frequent capillary replacements with higher equipment utilization rates and lower costs. ② Long life capillaries keep their initial wire-bond pull-strengths and

the selection of capillary part number process is simplified as follows: capillary tip the selection of capillary tip design is determined by the device and metallization, bond pad pitch, bond pad opening, wire size, target mashed ball diameter, and critical loop height to derive the hole diameter (hd), chamfer diameter (cd), chamfer angle (ca),

Wirebonding equipment use bonding tools known as capillaries for thermosonic ball bonding. Capillaries hold and control the bonding wire as well as form bonds from it during the ball bonding process. Capillaries are ceramic axial-symmetric tools with vertical feedholes (holes where the bonding wires are fed) through its center. Fig. 1.

Capillaries are high precision manufactured, with attributes specific to the wire diameter in use and bonding process parameters. Capillaries are manufactured from two main materials: Toughened Alumina. ATLAS (very high mechanical strength Alumina) The figure below describes the K&S capillary nomenclature: There are many factors to consider

Smallest bonding pitch: 25 μm using 18–20 μm diameter wire.Chip–chip assembly: Bond capillary touches bond pad during second bond, making this method unsuitable for chip-tochip bonding (risk of pad damage). However, there are workarounds like the use of stand-off-stitches, basically requiring a bond-stud to place on the second pad to

This study focus on five different capillaries with same tip design, namely of three standard design capillaries with different main taper angle (MTA) and two 

A gold wire passes through a ceramic bond capillary (a needle-like tool). Then a high-voltage electric charge melts the wire, creating a gold sphere (free air ball, or FAB) at the end. Next, the free air ball forms at the tip of the capillary, and the tool moves sideways to a position above the required bond pad on the device which is placed on

Common Causes of Wire Bonding Failures . Wire bond failures comprise a major concern of any semiconductor manufacturing company. Common causes of wire bond failures include the following:. 1) Voiding in the Bonds Atomic interdiffusion between different metals is a natural phenomenon in a wirebond metallurgical system. If left unchecked, however, this can lead to voids in the bond that can

Copper / Gold Wire Capillary · Long Life Capillary · High U.S. Energy Transfer · High Wear Resistance · High Bending Strength · Low Frictional Coefficient.

Capillary unplugging wire offers an easy economical way to unplug clogged capillary. This is especially useful for engineers during bonding evaluation when the optimum process parameters are not defined yet and the gold ball tends to get clogged in the capillary holes. This can be done by simply inserting the tip of the unplugging wire from the

Capillaries with tighter tolerance control and improved ceramic materials are necessary because the capillary tip diameter is extremely small for very fine 

4 µm Ag-5Au bonding alloy wire, and the influence of the geometric parameters of the ceramic capillary on the morphology of the alloy wire ball 

Wire diameter is a key factor in determining the appropriate hole size of the capillary. An optimal hole size is essential for a successful 

Wire Bonding Capillary Capillaries for manual and semi-automatic ball conder and wedge bonder for semiconductor packages.

The ProVertical Loop Process Enables. Vertically bonded wires per requirements - Target Wire Height & Form Angle. Minimized wire-to-wire pitch - No second bond knicking on substrate or

tip radius of the capillary, and increase in Young's modulus of the wire. These study results verify the feasibility of wire bonding at pitches of 70.

finishing process of ultra-fine pitch wire bonding capillaries. Presently, the packaging technology has reached the sub-50 micron bond pad pitch(BPP) device 

With over 40 years of experience, K&S Capillary Consumables is one of the leading players in the Latest capillary solution for copper wire bonding.

A two-step high bottleneck type capillary for a wire bonding device having a height of 1.5˜5.0 mm and taper of 10˜15° from the capillary end is disclosed.

Wire bonding ranks among popular and dominant interconnect technologies due to its reputation for versatility, performance, and reliability. In this type of bonding, the capillary does not contact the pad surface. For the second half of the bond, the capillary is moved to the location for the stitch bond. Here, the capillary rests against

KOSMA CAPILLARY. Kosma Co.. Ltd, is founded in 2001 and produces the semiconductor assembly subsidiary material (Capillary) with new material development as one of young venture corporation. Wire Bonding Capillaries Ruby, Ceruna, HT, SF, TAS, Mebius Series and DLC Plant: Floor Space: 1,400 SQm: Employees: 102 persons: ORGANIZATION